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Packaging Module Development Engineer

Intel Corp.Phoenix, AZ

$115,110 - $162,500 / year

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Overview

Schedule
Full-time
Education
Engineering (PE)
Career level
Senior-level
Remote
On-site
Compensation
$115,110-$162,500/year
Benefits
Health Insurance
Paid Vacation
401k Matching/Retirement Savings

Job Description

Job Details:

Job Description:

About the Role

Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.

Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.

What You'll Do

Key responsibilities will include but not limited to:

  • Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
  • Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
  • Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces)
  • Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
  • Define equipment specifications and partner with vendors to meet technical and performance requirements
  • Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
  • Lead technical problem-solving efforts and contribute to process innovation initiatives
  • Document findings and best practices through technical reports and knowledge-sharing forums
  • Support standardization of qualification processes, quality systems, and engineering methodologies

Behavioral traits that we are looking for:

  • Strong analytical and problem-solving mindset
  • Effective written and verbal communication skills
  • Ability to work independently and collaboratively in a team environment
  • Adaptability in a fast-paced, innovation-driven setting
  • Continuous improvement mindset with attention to detail

Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.

See Intel Benefits for more details.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Note:

For information on Intel's immigration sponsorship guidelines, please see

Intel U.S. Immigration Sponsorship Information

Minimum Qualifications and Experience:

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.

Your experience described above must be in the following:

  • Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Mechanical design software such as SolidWorks or AutoCAD.
  • Mechanical drawings and Geometric Dimensioning and Tolerancing.

Preferred Qualifications and Experience:

  • Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
  • Experience with high-precision manufacturing methods, including stamping and CNC machining.
  • Understanding of semiconductor fabrication processes and packaging technologies.
  • Familiarity with supply chain management in a manufacturing or materials qualification environment.
  • Previous related work experience in a semiconductor foundry preferred.

Be part of Intel's mission to innovate and advance the future of technology. Apply today to make an impact and shape the future of packaging solutions.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

  • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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FAQs About Packaging Module Development Engineer Jobs at Intel Corp.

What is the work location for this position at Intel Corp.?
This job at Intel Corp. is located in Phoenix, AZ, according to the details provided by the employer. Some roles may also include multiple work locations depending on the requirement.
What pay range can candidates expect for this role at Intel Corp.?
Candidates can expect a pay range of $115,110 and $162,500 per year.
What employment applies to this position at Intel Corp.?
Intel Corp. lists this role as a Full-time position.
What experience level is required for this role at Intel Corp.?
Intel Corp. is looking for a candidate with "Senior-level" experience level.
What education level is required for this job?
The education requirement for this position is Engineering (PE). Candidates with relevant qualifications or equivalent experience may also be considered.
What benefits are offered by Intel Corp. for this role?
Intel Corp. offers following benefits: Health Insurance, Paid Vacation, 401k Matching/Retirement Savings, and Health & Wellness Programs for this position. Actual benefits may vary depending on the employer's policies and employment terms.
What is the process to apply for this position at Intel Corp.?
You can apply for this role at Intel Corp. either through Sonara's automated application system, which helps you submit applications 10X faster with minimal effort, or by applying manually using the direct link on the job page.