Director of Technology & Quality - Semiconductors
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Job Description
Location
San Jose, CA (3-day hybrid schedule)
Compensation
Base Salary: $260,000 – $290,000
Annual Bonus: 25% of base
RSUs (Range Determined by Interview Performance)
Company Overview
A leading global technology solutions provider is seeking a highly experienced Director to
oversee multiple teams within its Semiconductor Technology & Quality division. The
organization prides itself on developing advanced networking and communications
products that power some of the most secure and reliable systems worldwide.
Role Summary
The Director will lead diverse engineering and quality-focused teams responsible for
delivering sophisticated semiconductor components—ASICs, memory, MPUs, COMMs,
and FPGAs. This position plays a critical role in ensuring products meet rigorous quality
and reliability standards throughout their lifecycle, from design and testing to integration in
high-performance network solutions.
Key Responsibilities
1. Strategic Leadership
o Develop and drive a unified vision for semiconductor quality, technology
development, and product reliability.
o Align the eorts of multiple functional teams to ensure timely achievements
across various project milestones.
2. Technical Oversight
o Spearhead qualification processes for all semiconductor components used
in advanced networking solutions.
o Oversee failure analysis, root-cause investigations, and reliability testing to
mitigate field risks.
o Guide advanced packaging and process technology projects to support nextgeneration
product architectures.
3. Team & Organizational Management
o Lead several teams (4–5 direct reports at the Principal Engineer/Manager
level) covering test labs, reliability, packaging & technology, and ASIC
development.
o Foster a culture of innovation, collaboration, and continuous learning within
a multi-tiered engineering organization.
4. Supplier Quality & Partnerships
o Engage with external partners to influence roadmap alignment, process
improvements, and stringent quality controls.
o Develop and maintain robust supplier relationships that ensure long-term
success in component sourcing.
5. Cross-Functional Collaboration
o Work closely with design engineering, manufacturing, supply chain, and
other internal stakeholders to integrate semiconductor components
seamlessly into finished products.
o Employ data-driven methodologies to proactively identify and address
potential risks across the product lifecycle.
Qualifications
1. Experience & Expertise
o 15+ years in semiconductor design, test, reliability, or quality.
o 10+ years in a leadership role managing teams in semiconductor
manufacturing, custom ASIC development, or related technology fields
o Proven ability to balance depth in one or more technical domains (e.g., ASIC
design, packaging, reliability) with broad oversight across multiple
semiconductor disciplines.
2. Educational Background
o Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or
a related field (PhD preferred but not mandatory).
3. Leadership & Communication
o Track record of guiding cross-functional teams and influencing senior
stakeholders, including suppliers.
o Ability to synthesize complex technical information into actionable business
insights.
4. Strategic Vision & Problem-Solving
o Demonstrated success in driving large-scale, innovative solutions to address
complex semiconductor quality and reliability challenges.
o Skilled at anticipating evolving technical demands and adapting processes to
maintain a competitive edge.
5. Cultural Fit & Adaptability
o Comfortable operating in a hybrid work environment, balancing on-site
leadership with remote collaboration.
o Strong business acumen and readiness to adapt strategies in line with
organizational goals.
Team Structure
Direct Reports: 4–5 teams led by Principal Engineers or Managers.
Functional Areas:
1. Test Labs – Component validation and testing.
2. Reliability – Ensuring robust, long-term performance.
3. Packaging & Technology – Developing advanced packaging innovations.
4. ASIC Development – Designing and qualifying custom ASIC solutions.
Key Screening Topics
System-Level Integration: Understanding how semiconductor components are
ultimately used in product designs.
Leadership Approach: Proven strategies for motivating and aligning diverse
technical teams.
Technology Roadmapping: Experience shaping suppliers’ technology roadmaps
and synchronizing with product strategies.
Failure Analysis & Risk Mitigation: Concrete examples of managing critical issues
from root-cause investigation to field risk assessment.
Quality Metrics & KPIs: Familiarity with setting and measuring the right
performance indicators to ensure continuous improvement.
Why Join?
Influence & Impact: Shape technology strategies that directly aect high-visibility
network solutions.
Innovative Environment: Lead teams at the forefront of semiconductor
advancement, driving cutting-edge R&D.
Career Growth: Competitive compensation, with strong potential for both
professional development and financial rewards.
Collaborative Culture: Engage with cross-functional teams in an inclusive, resultsdriven
environment.Location: San Jose, CA (3-day hybrid schedule)
Compensation:
* Base Salary: $260,000 – $290,000
* Annual Bonus: 25% of base
* RSUs (Range Determined by Interview Performance)
Company Overview:
* Leading global technology solutions provider seeking a highly experienced Director for its Semiconductor Technology & Quality division.
* Focuses on developing advanced networking and communications products.
Role Summary:
* Lead diverse engineering and quality-focused teams responsible for delivering semiconductor components (ASICs, memory, MPUs, COMMs, and FPGAs).
* Ensure products meet quality and reliability standards throughout their lifecycle.
Key Responsibilities:
* Strategic Leadership:
* Develop and drive a unified vision for semiconductor quality, technology development, and product reliability.
* Align efforts of multiple functional teams.
* Technical Oversight:
* Spearhead qualification processes for all semiconductor components.
* Oversee failure analysis, root-cause investigations, and reliability testing.
* Guide advanced packaging and process technology projects.
* Team & Organizational Management:
* Lead 4–5 direct reports at the Principal Engineer/Manager level.
* Foster a culture of innovation and collaboration.
* Supplier Quality & Partnerships:
* Engage with external partners to influence roadmaps and quality controls.
* Maintain robust supplier relationships.
* Cross-Functional Collaboration:
* Work with design engineering, manufacturing, supply chain, etc.
* Employ data-driven methodologies to address potential risks.
Qualifications:
* Experience & Expertise:
* 15+ years in semiconductor design, test, reliability, or quality.
* 10+ years in a leadership role managing teams.
* Proven ability to balance technical depth with broad oversight.
* Educational Background:
* Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related field (PhD preferred but not mandatory).
* Leadership & Communication:
* Track record of guiding cross-functional teams.
* Ability to synthesize complex technical information.
* Strategic Vision & Problem-Solving:
* Demonstrated success in driving innovative solutions.
* Skilled at anticipating technical demands and adapting processes.
* Cultural Fit & Adaptability:
* Comfortable in a hybrid work environment.
* Strong business acumen and adaptability.
Team Structure:
* Direct Reports: 4–5 teams led by Principal Engineers or Managers.
* Functional Areas:
* Test Labs – Component validation and testing.
* Reliability – Ensuring robust, long-term performance.
* Packaging & Technology – Developing advanced packaging innovations.
* ASIC Development – Designing and qualifying custom ASIC solutions.
Key Screening Topics:
* System-Level Integration
* Leadership Approach
* Technology Roadmapping
* Failure Analysis & Risk Mitigation
* Quality Metrics & KPIs
Why Join?
* Influence & Impact
* Innovative Environment
* Career Growth
* Collaborative Culture