Manager, Applications Science

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers' critical path of progress by making them smarter, faster and more efficient.

Job Summary & Responsibilities

Key Responsibilities:

• Technical Collaboration & Support:

• Serve as the primary modeling lead for Intel D1D engagement, providing scatterometry-based optical TF/OCD/ML applications support across multiple layers and processes.

• Work directly with Intel R&D and process teams to align on roadmap requirements, technical needs, and metrology challenges.

• Deliver high-quality post-sales support to ensure sustained tool performance and customer satisfaction.

• Strategic Engagement & Capability Development:

• Enhance technical relationships through regular onsite interaction and strategic communication with Intel stakeholders.

• Identify and advocate for new modeling features, tool enhancements, and roadmap alignment based on customer feedback and industry trends.

• Coordinate with internal R&D and product teams to drive innovation based on joint development needs.

• Project Leadership & Opportunity Enablement:

• Lead and manage modeling aspects of key customer demos, head-to-head (H2H), and product evaluations.

• Execute modeling deliverables in joint programs that enable or expand layer share, open new opportunities, or strengthen existing engagements.

• Document, track, and report modeling results and success metrics to internal and external stakeholders.

• Cross-functional Collaboration:

• Act as the bridge between field teams, engineering, and internal applications by translating technical challenges into actionable modeling and product development efforts.

• Support integration of modeling into Onto's metrology solutions across multiple platforms.

Qualifications

• MS or PhD in Physics, Electrical Engineering, Materials Science, or related field.

• 5+ years of experience in semiconductor metrology or modeling, ideally in OCD, SE, or scatterometry applications.

• Familiarity with advanced logic or memory (e.g., GAA, DRAM, 3D NAND) process flows and structural challenges.

• Strong customer-facing experience, preferably supporting Intel or other advanced R&D fabs.

• Excellent problem-solving, communication, and project management skills.

• Hands-on experience with modeling tools.

Onto Innovation Inc. offers competitive salaries and a generous benefits package, including health/dental/vision/life/disability, PTO, 401K plan with employer match, and an Employee Stock Purchase Program (ESPP) along with health & wellness initiatives. We provide a collaborative working environment along with resources, and state-of-the-art tools & equipment to promote success; and a welcoming, inclusive corporate culture where individuals are recognized for their contributions.

Onto Innovation Inc. is an Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.

For positions requiring access to technical data, Onto Innovation Inc., Inc. may have to obtain export licensing approval from the U.S. Department of Commerce- Bureau of Industry and Security and/or the U.S. Department of State- Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.