Packaging Module Equipment Development Engineer

Job Details:

Job Description:

• Develops assembly equipment for integration readiness of various product architectures applying novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

• Optimizes and improves the efficiency of manufacturing by developing equipment and integrated processes to meet safety, quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

• Integrates new process materials defining equipment and application specifications for enabling quality product high volume manufacturing.

• Establishes equipment specifications and selects equipment model and vendors based on existing equipment capabilities and product technology needs.

• Interfaces with supplier quality and procurement teams to ensure equipment quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.

• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.

• Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur.

• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones. Works on-site in office and in factory cleanroom for hands-on and face-to-face interaction with equipment and partners to complete job requirements.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Qualifications:

Minimum Qualifications:

• The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related field with 6+ years of industry experience

• -OR- Master's degree in Engineering, Physics, Chemistry or related field with 4+ years of industry experience

• -OR- PhD degree in Engineering, Physics, Chemistry or related field with 2+ years of industry experience

Preferred Qualifications:

• Preference for experience with plasma, mold, polish/grind, oven and/or dispense equipment technologies.

• Semiconductor specific experience or research with hands-on equipment support or development.

• Equipment selection and first time process and manufacturing integration.

• Equipment sustaining, change control management and quality data systems.

• Project management and delivering results for time critical technical projects.

• Technical innovation and deliver results for complex, time critical technical projects.

• Semiconductor fabrication processes and technology.

• Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

• Previous related work experience in a semiconductor foundry preferred

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US: $110,880.00-216,140.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.