Senior Manager, Packaging Development

We are looking for a Senior Manager to lead the development, manufacturing, and optimization of packaging solutions of our ion traps that enable scalable, high-fidelity quantum operations. In this role, you will manage a diverse team focused on packaging design, assembly, and characterization for quantum computers through all product lifecycles. In addition, you will work closely with other program and component team leads to define subsystem interfaces, device requirements, and project timelines. Your role also includes maturing the engineering approach to facilitate our mission to build the world's best quantum computers to solve the world's most complex problems.

Responsibilities:

• Define and execute the roadmap for packaging solutions of ion traps at the heart of IonQ quantum computers
• Work closely with the ion trap and vacuum systems teams to enable seamless system integration of ion traps
• Develop novel characterization techniques and drive verification and validation of new designs, materials, and processes
• Identify design improvements and changes to improve process repeatability and reliability of opto-electronic packages, in partnership with manufacturing team
• Monitor project performance to understand impacts to cost, schedule, and technical capability; understand status and actively address issues during development; determine critical path amongst cross-functional deliverables and drive the critical decisions to reduce project time
• Assist with the transition from research and development to production, including development of technology demonstrations and implementing faster learning cycles
• Coach and develop team members on skill proficiency and performance with regular feedback

You'd be a good fit with:

• Masters or higher in Engineering or relevant field/discipline
• 5+ years managing a cross-functional team of engineers or scientists doing technical development or prototyping
• 5+ years of hands-on design and process development of novel electronics or device packaging, ideally working within a cleanroom and with experience in RF device manufacturing
• Experience establishing relationships with external partners and managing vendors
• Expertise in novel opto-electronic packaging, and its qualification
• Expertise in precision hybrid integration of micro-optical elements
• Strong leadership and project management skills with the ability to drive cross-functional collaboration and manage a diverse team of engineers and scientists
• Excellent communication skills and ability to present to a broad audience at all levels of the company

You'd be a great fit with:

• Expertise in identifying, analyzing, and using packaging techniques, components, and materials to manage mechanical and thermal stresses
• Ultra-High Vacuum (UHV) device/component handling and knowledge of cryogenic and UHV-compatible materials
• Familiarity with integration of ion traps with other quantum systems, including vacuum, cryogenic, and control electronics
• Experience with data aggregation and statistical analysis/reporting, and Jira for project management

Location: This role is based at our office in College Park, MD, with the option to work remotely a few days a week.

Travel: Up to 10%

Job ID: 1048

The approximate base salary range for this position is $187,358 - $245,300. The total compensation package includes base, bonus, and equity.