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Director of Engineering (Packaging)

EpsilonRCedar Rapids, Iowa

$166,600 - $333,100 / year

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Overview

Schedule
Full-time
Career level
Executive
Remote
On-site
Compensation
$166,600-$333,100/year
Benefits
Health Insurance
Paid Vacation
Parental and Family Leave

Job Description

OverviewWe’re seeking a strategic and technically strong Director of Packaging to lead packaging innovation and technology coordination within the business unit. This role is critical in shaping our product development efforts through advanced packaging design, technology planning, and design automation. You'll work cross-functionally with engineering, manufacturing, IT, and sourcing teams to drive roadmap execution, enable scalability, and improve design methodologies.

Key Responsibilities

  • Packaging Leadership:

    • Own and drive the business unit’s packaging roadmap, focusing on technologies such as LGA, dual-side BGA, wire bond, and flip-chip.

    • Collaborate with engineering teams to plan platforms in advance of development cycles.

    • Lead initiatives to reduce package size by 20% annually.

    • Coordinate closely with manufacturing partners and internal stakeholders to align technology capabilities.

    • Oversee test vehicle builds to validate concepts and support future technologies.

  • Technology Strategy:

    • Track and report technology usage to support capacity and diversification planning.

    • Maintain oversight of process technologies (SOI, Si, HBT/BiHEMT, BAW/TCSAW) used in new products.

  • Design Automation & Tools:

    • Partner with DA teams to improve tool flows (Cadence Virtuoso, ADS, HFSS, EMX).

    • Drive automation and 3D packaging integration across module design processes.

  • Development & Prototyping:

    • Support proto line development and ensure smooth transition to production.

    • Interface with design teams and suppliers to align packaging needs and enable new solutions.

    • Manage EVB development and ensure vendor capabilities match evolving product requirements.

  • IT & Systems Integration:

    • Collaborate with IT to enhance internal tools, databases, and documentation systems (Agile, SharePoint, SQL, etc.).

    • Drive improvements in data systems supporting packaging and design processes.

Qualifications

  • BS with 15+ years, MS with 12+ years, or PhD with 8+ years in semiconductor packaging or related field

  • Strong expertise in:

    • Packaging & PCB technologies

    • Design for manufacturing & reliability

    • Electrical simulation tools

    • Product and test engineering

    • Cross-functional team leadership

Compensation & BenefitsSalary range: $166,600 – $333,100 USD, depending on experience and location.Benefits include: premium-free medical plan, 401(k) with match, ESPP, paid time off (vacation, parental, wellness), bonus eligibility, and performance-based equity.

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FAQs About Director of Engineering (Packaging) Jobs at EpsilonR

What is the work location for this position at EpsilonR?
This job at EpsilonR is located in Cedar Rapids, Iowa, according to the details provided by the employer. Some roles may also include multiple work locations depending on the requirement.
What pay range can candidates expect for this role at EpsilonR?
Candidates can expect a pay range of $166,600 and $333,100 per year.
What employment applies to this position at EpsilonR?
EpsilonR lists this role as a Full-time position.
What experience level is required for this role at EpsilonR?
EpsilonR is looking for a candidate with "Executive" experience level.
What benefits are offered by EpsilonR for this role?
EpsilonR offers following benefits: Health Insurance, Paid Vacation, Parental and Family Leave, 401k Matching/Retirement Savings, and Health & Wellness Programs for this position. Actual benefits may vary depending on the employer's policies and employment terms.
What is the process to apply for this position at EpsilonR?
You can apply for this role at EpsilonR either through Sonara's automated application system, which helps you submit applications 10X faster with minimal effort, or by applying manually using the direct link on the job page.