Head Of IC Design
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Overview
Job Description
Role Purpose
Lead Power Integrations' global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.
This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.
Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.
Business Ownership & Impact
- Own execution and delivery of all IC development programs.
- Ensure predictable silicon delivery aligned to product commitments.
- Drive improvements in:
o First-pass silicon success
o Development cycle time
o Design productivity and reuse
- Balance design innovation with execution risk and schedule confidence.
- Ensure designs meet:
o Performance targets
o Cost and area targets
o Manufacturability and yield requirements
Core Responsibilities
IC Design Execution & Delivery
- Lead all IC development across:
o Analog design
o Digital design
o Mixed-signal integration
o Design verification
o CAD/Layout
o Design reuse
- Ensure high-quality execution from specification through tape-out and silicon validation.
- Deliver designs that meet schedule, performance, cost, and quality targets.
Alignment to Product & Marketing Requirements
- Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
- Provide early input on feasibility, risk, and trade-offs.
- Maintain alignment between architecture intent and silicon implementation.
Design Methodology & Productivity
- Establish best-in-class design methodologies, tools, and flows.
- Drive improvements in:
o Design reuse
o Verification coverage
o Silicon iterations
o Time-to-functioning silicon
- Build scalable design infrastructure to support future growth.
Cross-Functional Integration
- Partner closely with:
o Product & Technology (architecture and requirements)
o Marketing (roadmap alignment)
o Operations (process, yield, cost, backend execution)
o Business Units (application needs and priorities)
- Ensure tight alignment between design, manufacturing, and system requirements.
Risk Management & Predictable Execution
- Implement disciplined design and verification processes to reduce execution risk.
- Identify and manage technical risks early in the development cycle.
- Ensure high confidence in tape-out schedules and silicon success.
- Drive a culture of accountability and delivery predictability.
Organizational Leadership
- Lead global IC design teams across regions.
- Build a strong technical culture focused on:
o Quality
o Execution discipline
o Risk management
o Design reuse
o Continuous improvement
- Recruit, develop, and retain top engineering talent.
Ideal Profile
- 15+ years of experience in IC design (analog, mixed-signal, or power ICs).
- Proven leadership of global IC design teams.
- Deep expertise in:
o High-voltage / power IC design
o Mixed-signal integration
o Semiconductor processes (BCD, HV, GaN preferred)
- Strong track record of delivering silicon on schedule with high quality.
- Experience improving design productivity and execution predictability.
- Strong cross-functional collaboration skills across product, marketing, and operations.
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