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New Product Introduction (NPI) Process & Tooling Engineer – Liquid Cooling

HPCorvallis, Oregon

$93,400 - $182,400 / year

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Overview

Schedule
Full-time
Education
Bachelor's/Undergraduate Degree
Engineering (PE)
Career level
Senior-level
Remote
On-site
Compensation
$93,400-$182,400/year
Benefits
Dental Insurance
Disability
Health Insurance

Job Description

New Product Introduction (NPI) Process & Tooling Engineer – Liquid Cooling

Description -

New Product Introduction (NPI) Process & Tooling Engineer – Liquid Cooling

Please note: This evergreen requisition is used to fill multiple New Product Introduction (NPI) Process & Tooling Engineers

Job Description

Are you passionate about technology and eager to work in a startup environment that leverages the brand recognition, solution capabilities, and global reach of a world-class technology pioneer like HP?

This Process and Tooling Engineering position is within HP’s liquid cooling solutions business in the Microfluidic Technology Organization (MTO). This role supports both R&D prototyping and production processes, helping scale manufacturing from prototype through pilot and into stable production—particularly in a high-mix / low-volume (HMLV) environment.

Depending on experience level, you will contribute as an individual technical owner and/or technical lead to solve complex business and engineering challenges, work effectively through ambiguity, and drive decisions that reduce risk at launch while improving quality, cycle time, and cost.

NPI Process and Tooling Engineering – What you will do

  • Support end-to-end NPI industrialization for liquid cooling hardware: help translate product requirements into a manufacturing strategy and executable plan from prototype builds through pilot and production ramp.
  • Execute and/or lead proto-to-pilot scale-up learning loops: define build matrices, run defect review and disposition mechanisms, establish criteria for process lock, and drive fast, data-based iteration to stabilize yield and capability.
  • Help define and implement manufacturing approaches for HMLV environments, including line/workcell design, WIP control, standard work, and staffing/tooling readiness to meet program schedule.
  • Develop, specify, and qualify process tooling and equipment (custom fixtures, assembly tooling, leak test tooling, metrology, and supporting automation) to meet capability, throughput, and cost targets.
  • Partner with suppliers and internal stakeholders for tooling and critical process capability: contribute to specifications/SOWs, support buy vs. build decisions, help select suppliers, and support build/qualification, acceptance, and commissioning activities.
  • Contribute to quality planning and gating appropriate to proto/pilot/early production (e.g., control plans, in-process vs. end-of-line inspection strategy, traceability, sampling approaches) in partnership with Quality and Manufacturing.
  • Drive structured root cause and corrective action when issues arise in prototype and production (e.g., 8D/CLCA), including containment, robust fixes, and verification of effectiveness.
  • Partner closely with R&D, Manufacturing, Quality, Supply Chain, and Program teams to support design-for-manufacturability (DFM), development effectiveness, and launch readiness; communicate status, risks, and trade-offs to stakeholders.
  • Depending on level, provide technical guidance to other engineers and/or help establish standards and best practices that raise team capability.

Qualifications

  • Education: Bachelor’s or Master’s degree in Mechanical, Manufacturing, Electrical, Chemical, or Materials Engineering (or equivalent practical experience).
  • Experience: Typically 5+ years (mid-level) or 10+ years (senior/staff) in NPI, manufacturing engineering, process development, tooling/fixture development, and/or production scale-up for complex hardware.
  • Ability to lead and/or contribute to cross-functional prototype-to-production ramps, including manufacturing strategy, readiness gates, and systematic risk reduction (scope and autonomy aligned to experience level).
  • Tooling & process ownership: experience specifying, designing, procuring, and/or qualifying custom tooling and/or capital equipment. Experience improving process capability through SPC, data analysis, process characterization, and gauge studies.
  • Quality systems mindset: experience supporting early-life quality strategies (control plans, inspection/test strategy, traceability) and participating in or leading structured corrective actions (e.g., 8D).

Preferred / desirable

  • Experience with precision assembly and tight-tolerance tooling and metrology (e.g.,
  • Experience in thermal management, liquid cooling, microfluidics, or adjacent high-reliability hardware domains.
  • Comfort operating in fast-paced engineering environments with evolving priorities and a high degree of ambiguity.
  • Strong analytical, problem-solving, planning, organizational, and documentation skills; ability to communicate clearly and influence technical decisions across levels.
  • Ability to deliver clear, effective technical presentations to inform and persuade peers, partners, and leadership.
  • The pay range for this role is $93,400.00 to $182,400.00 USD annually with additional
  • opportunities for pay in the form of bonus and/or equity (applies to United
  • States of America candidates only). Pay varies by work location, job-related
  • knowledge, skills, and experience.

    Benefits:

    HP offers a comprehensive benefits package for this position, including:

     * Health insurance * Dental insurance * Vision insurance * Long term/short term disability insurance * Employee assistance program * Flexible spending account * Life insurance * Generous time off policies, including; * 4-12 weeks fully paid parental leave based on tenure * 11 paid holidays * Additional flexible paid vacation and sick leave (US benefits overview

  • [https://hpbenefits.ce.alight.com/])

    • The compensation and benefits information is accurate as of the date of this• posting. The Company reserves the right to modify this information at any time,• with or without notice, subject to applicable law.

    Disclaimer• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

    Job -

    Engineering

    Schedule -

    Full time

    Shift -

    No shift premium (United States of America)

    Travel -

    Relocation -

    Yes

    Equal Opportunity Employer (EEO)

    HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

    Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

    For more information, review HP’sEEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

    Automate your job search with Sonara.

    Submit 10x as many applications with less effort than one manual application.

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    FAQs About New Product Introduction (NPI) Process & Tooling Engineer – Liquid Cooling Jobs at HP

    What is the work location for this position at HP?
    This job at HP is located in Corvallis, Oregon, according to the details provided by the employer. Some roles may also include multiple work locations depending on the requirement.
    What pay range can candidates expect for this role at HP?
    Candidates can expect a pay range of $93,400 and $182,400 per year.
    What employment applies to this position at HP?
    HP lists this role as a Full-time position.
    What experience level is required for this role at HP?
    HP is looking for a candidate with "Senior-level" experience level.
    What education level is required for this job?
    The education requirement for this position includes Bachelor's/Undergraduate Degree and Engineering (PE). Candidates with relevant qualifications or equivalent experience may also be considered.
    What benefits are offered by HP for this role?
    HP offers following benefits: Dental Insurance, Disability, Health Insurance, Life Insurance, Vision Insurance, Paid Holidays, Paid Illness Leave, Paid Time Off, and Parental Leave for this position. Actual benefits may vary depending on the employer's policies and employment terms.
    What is the process to apply for this position at HP?
    You can apply for this role at HP either through Sonara's automated application system, which helps you submit applications 10X faster with minimal effort, or by applying manually using the direct link on the job page.