Packaging Engineer

As a family-run, high-tech company with nearly 19,000 employees at 71 locations worldwide, we are looking for forward thinkers with unconventional ideas and drive to join our team. Our company culture, which values collaboration and mutual trust, creates the ideal framework for boldly trying new things and questioning the status quo. Our technologies inspire people to develop and produce things that are currently unimaginable. Whether lasers, machine tools, EUV or electronics - TRUMPF is building technological worlds for future generations. Are you ready for new challenges?

Join a team pushing the limits of laser technology. As a Packaging Engineer, you'll own critical processes that turn cutting-edge diode laser devices into production-ready powerhouses-driving performance through precision mounting, bonding, and interface characterization.

You'll be the go-to expert for key production tools and processes, championing uptime, stability, and continuous improvement while partnering closely with R&D to bring new concepts to life on the factory floor.

What you'll do

• Own and optimize die bonding and wire bonding processes and tools for high‑power diode lasers.
• Lead interface characterization and packaging process tuning based on optical KPIs (power, voltage, slow axis, smile, placement accuracy, etc.).
• Take full ownership of production equipment: process control, sustaining, tool uptime, and maintenance troubleshooting.
• Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
• Lead and contribute to 4D/8D problem-solving and shepherd ECNs, including MES/Database updates.
• Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.
• Use SPC, MSA, DOE, and JMP/Minitab to deliver data‑driven process improvements.
• Tackle complex equipment and process issues with structured troubleshooting; deliver high‑quality results on time.
• Communicate clearly, influence cross‑functional teams, and mentor peers while executing well‑defined tasks with guidance as needed.

What you bring

• BS or MS in Mechanical/Electrical Engineering, Materials Science, or Physics.
• 3+ years hands‑on with die attach, thermocompression bonding, wire bonding, vacuum reflow, and pick‑and‑place.
• Manufacturing support experience in lasers or semiconductors (preferred).
• Familiarity with K&S or F&K wire bonders, and/or SET die bonders (plus).
• Strong with JMP, Minitab, or similar statistical tools; fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).
• Proven track record driving cross‑functional issue resolution and leading teams.
• Comfortable in a cleanroom environment (gowning required).
• Excellent communicator who gives and receives feedback constructively.

Why this role

• Impact: Your processes directly shape performance in advanced laser products.
• Variety: From sustaining and yield to ECNs and new‑process quals-no two days are the same.
• Growth: Work at the intersection of production and R&D with room to lead.

Pay Range: $93,253.50 - $112,504

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