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Sr. Hardware Engineer (Teradyne, Oregon)

Teradyne, Inc.Tualatin, OR

$141,400 - $226,200 / year

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Overview

Schedule
Full-time
Education
Engineering (PE)
Career level
Senior-level
Remote
On-site
Compensation
$141,400-$226,200/year
Benefits
Health Insurance
Dental Insurance
Vision Insurance

Job Description

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team - one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

The Senior Hardware Engineer in the hardware group is responsible for designing, developing, and validating high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment. This role focuses on power delivery architecture, fast transient response, load regulation, protection systems, thermal management, and system‑level integration to support advanced SoCs, FPGAs, high‑power devices, and complex test conditions. The engineer owns power‑delivery modules from concept through production release and collaborates across hardware, firmware, mechanical, and test engineering teams.

Power Delivery Architecture & Design

  • Architect and design high‑current power delivery modules (from mA to 100+ A) for ATE systems.
  • Develop fast‑response voltage/current sourcing circuits optimized for dynamic load conditions, droop control, and transient performance.
  • Implement advanced power‑stage topologies (buck, multiphase, linear, hybrid) tailored for semiconductor test environments.
  • Design for wide operating ranges, including high‑voltage rails, low‑voltage/high‑current rails, and dynamic voltage scaling.

Power Integrity & Transient Performance

  • Optimize power integrity across the full PDN (instrumentation → cabling → loadboard → DUT).
  • Model and mitigate droop, overshoot, ringing, and ground bounce under fast load steps.
  • Perform simulation and analysis of loop stability, compensation networks, and transient response.
  • Ensure compliance with DUT power‑up sequencing, ramp rates, and timing constraints.

Protection, Reliability & Safety

  • Design robust protection systems including OCP, OVP, OTP, short‑circuit protection, and fault‑isolation mechanisms.
  • Implement fast fault‑response circuits to protect sensitive DUTs and ATE hardware.
  • Conduct reliability analysis, derating studies, and thermal modeling for long‑term stability.
  • Support HALT/HASS, stress testing, and failure‑mode investigations.

Switching, Routing & Load Management

  • Develop efficient high‑current solutions for routing power to multiple DUT pins or sites.
  • Engineer low‑impedance, low‑loss paths for high‑current delivery with attention to thermal and mechanical constraints.
  • Collaborate with mechanical teams on heatsinking, airflow, and thermal interface design.

Bring‑Up, Debug & Validation

  • Lead bring‑up of new power‑delivery modules, performing root‑cause analysis of analog, digital, and mixed‑signal issues.
  • Execute characterization plans for load regulation, transient response, efficiency, thermal behavior, and fault handling.
  • Use advanced lab equipment (power analyzers, high‑bandwidth scopes, current probes, electronic loads) to validate performance.

ATE System Integration

  • Ensure power‑delivery modules meet ATE system‑level requirements for timing, triggering, synchronization, and software control.
  • Collaborate with firmware teams on control loops, telemetry, calibration, and fault‑reporting algorithms.
  • Create and use ATE test programs to validate instrument and system level designs.
  • Support integration with loadboards, probecards, and DUT power‑delivery networks.

Cross‑Functional Collaboration

  • Work with product engineering, test engineering, and silicon teams to define power‑delivery requirements for new devices.
  • Provide technical mentorship and contribute to power‑delivery design standards and best practices.

All About You

  • 8- 10+ years of experience in power electronics, high‑current power delivery, or instrumentation hardware design.
  • Strong expertise in switching power supplies, multiphase regulators, linear regulators, and power‑stage design.
  • Experience with power integrity, transient analysis, and compensation/stability design.
  • Proficiency with SPICE simulation, PDN modeling tools, and PCB design tools.
  • Hands‑on experience with power measurement equipment and high‑current test setups.
  • Strong analytical and debugging skills.
  • Experience designing power‑delivery modules for ATE instrumentation.
  • Knowledge of dynamic voltage scaling, digital power control, and telemetry systems.
  • Familiarity with high‑current connectors, cabling, and low‑impedance mechanical design.
  • Understanding of thermal modeling, heatsink design, and system‑level thermal constraints.
  • Bachelor's or Master's degree in Electrical Engineering or related field.

Compensation:

The base salary range for this role is $141,400 - $226,200. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits:

Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. Please click here to see details.

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FAQs About Sr. Hardware Engineer (Teradyne, Oregon) Jobs at Teradyne, Inc.

What is the work location for this position at Teradyne, Inc.?
This job at Teradyne, Inc. is located in Tualatin, OR, according to the details provided by the employer. Some roles may also include multiple work locations depending on the requirement.
What pay range can candidates expect for this role at Teradyne, Inc.?
Candidates can expect a pay range of $141,400 and $226,200 per year.
What employment applies to this position at Teradyne, Inc.?
Teradyne, Inc. lists this role as a Full-time position.
What experience level is required for this role at Teradyne, Inc.?
Teradyne, Inc. is looking for a candidate with "Senior-level" experience level.
What education level is required for this job?
The education requirement for this position is Engineering (PE). Candidates with relevant qualifications or equivalent experience may also be considered.
What benefits are offered by Teradyne, Inc. for this role?
Teradyne, Inc. offers following benefits: Health Insurance, Dental Insurance, Vision Insurance, Disability Insurance, Life Insurance, Paid Holidays, Paid Vacation, 401k Matching/Retirement Savings, Tuition/Education Assistance, and Health & Wellness Programs for this position. Actual benefits may vary depending on the employer's policies and employment terms.
What is the process to apply for this position at Teradyne, Inc.?
You can apply for this role at Teradyne, Inc. either through Sonara's automated application system, which helps you submit applications 10X faster with minimal effort, or by applying manually using the direct link on the job page.