Engineering Jobs 2026 (Now Hiring) – Smart Auto Apply

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using TSV (Through Silicon Via), we stack multiple DRAM chips on a high-speed memory controller with an integrated logic chip in one package, significantly increasing memory density and bandwidth through parallelization. Our designs leverage both custom digital and RTL2GDS flows, and our ultimate goal is to deliver the lowest power per bit solutions in the industry.

You will help shape next-generation High Bandwidth Memory solutions for artificial intelligence and accelerated computing. You will serve as a senior technical contributor and technical project leader, guiding work from architecture definition through silicon bring-up and post-silicon support. You will partner across design, process, packaging, and product teams to deliver reliable silicon with broad business impact. You will influence future memory architectures while mentoring engineers and improving design execution.

Responsibilities will include, but are not limited to:

• Own and deliver critical High Bandwidth Memory (HBM) design blocks and subsystems from architectural definition through schematic, implementation, verification, tape-out, and post-silicon debug.

• Drive robust, high-performance designs by balancing performance, power, reliability, yield, and manufacturability trade-offs.

• Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, architecture, process integration, and packaging interactions.

• Serve as technical project lead for one or more HBM programs, coordinating execution across architecture, layout, verification, validation, process integration, packaging, test, and product engineering teams.

• Define and communicate technical strategy, priorities, and execution plans while proactively identifying risks, dependencies, and schedule impacts.

• Research, develop, and influence next-generation HBM architectures aligned with artificial intelligence, machine learning, and high-performance computing workloads.

• Apply deep knowledge of Dynamic Random-Access Memory (DRAM) operation, Joint Electron Device Engineering Council (JEDEC) specifications, memory subsystems, and high-speed interfaces to architect scalable, future-ready solutions.

• Mentor engineers through design reviews, architectural guidance, and hands-on problem-solving while driving improved design methods, guidelines, and execution discipline across HBM programs.

Minimum Qualifications:

• 15+ years of experience in DRAM, HBM, advanced memory, system-on-chip, or application-specific integrated circuit design roles.

• Proven experience delivering complex designs from architecture through silicon bring-up and post-silicon debug.

• Strong expertise in DRAM operation and JEDEC standards, preferably including HBM product families.

• Extensive experience with complementary metal-oxide-semiconductor circuit design, transistor-level design, and semiconductor device physics.

• Demonstrated technical project leadership across multidisciplinary engineering teams.

Preferred Qualifications:

• Experience with digital design using Register Transfer Level methodologies such as Verilog, or similar.

• Experience with analog modeling and simulation tools such as FastSpice, HSPICE, or similar.

• Deep technical expertise in one or more areas such as DRAM memory array design, high-speed clocking and interface design, logic and custom circuit design, or power delivery optimization.

• Exposure to 2.5D or 3D packaging technologies, including through-silicon vias, hybrid bonding, or interposers.

• Strong communication skills, with the ability to explain complex technical concepts to engineers, leaders, and customers.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visitmicron.com/careers

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